Research & Development
R & D TOPICS
Hardener
New Allyl-typed Hardeners for Printed Circuit Board [PDF]watch video
lower addition level, low volatility, high heat resistance, PPE
Biomass-based Hardeners for Thermosetting Resin [PDF]
biomass-based, low dielectric, high heat resistance, active ester, hardener, renewable energy
Product X [PDF]
low temperature curability, high heat resistance, thermosetting resins, resol, epoxy
Raw material for resin
Ester-linked tetracarboxylic dianhydrides using Bio-based Material [PDF]watch video
biomass-based, colorless, high transparent, low refractive index, low birefringence, low dielectric constant, polyimide
Ester-linked tetracarboxylic dianhydrides for Thermoplastic Polyimide [PDF]
thermoplastic, colorless, transparent, heat-resistant, polyimide
Ester-linked tetracarboxylic dianhydrides for Transparent Polyimide [PDF]watch video
colorless, transparent, low CTE, high solubility, polyimide
Ester-linked tetracarboxylic dianhydrides for Low Dielectric Constant Polyimide [PDF]watch video
low Dk, low Df, heat-resistant, polyimide
Derivatives from Specialty Bisphenols [PDF]watch video
transparent, high refractive index, high heat resistance, polycarbonates, epoxy
High Heat-Resistant PAEK Monomers for Low Dielectric Materials [PDF]
low Dk, low Df, high heat resistance, flexibility, polyether, Poly Aryl Ether Ketone, PAEK, Poly Ether Ether Ketone, PEEK, glycol, polymer alloy
Thermosetting resin
Benzoxazine Monomers with Low Temperature Curable [PDF]watch video
low-temperature curability, high heat resistance, low-viscosity, Benzoxazine, BOZ, Curing with epoxy, Curing with Bismaleimido
Crosslinking agent
Phenolic Methylolă»Methoxymethyl Crosslinking agent [PDF]watch video
crosslinkability adjustment, Addition of heat resistance, photoresist
Photoresist raw materials/additives
Polyphenol for Electronic Materials [PDF]
high heat resistance, High sensitivity, high solubility, photosensitive material